Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
1～10 item / All 10 items
We will form circuit patterns of thick copper on glass using the subtractive method and semi-additive method.
It has a high transmittance and can be used for substrates of optical passive components. It has a low coefficient of thermal expansion, excellent dimensional stability, and mounting reliability. It has minimal warping, excellent flatness, and is easy to mount.
We will provide high-quality substrates just in time.
We provide high-quality printed circuit boards just in time. From prototyping to mass production, we offer a wide range of responses tailored to the needs of both domestic and overseas PCB manufacturers. 【Features】 - Flexible printed circuit boards (FPC) - PET boards - IC tag inlets - Rigid single-sided to high multilayer - IVH/BVH boards - Build-up boards - Metal core boards - Aluminum boards - High current boards - Halogen-free compliant *For details, please request our materials.
We deliver from prototypes to mass-produced products in a short lead time. Please feel free to consult us about anything related to circuit boards.
Each manufacturing process is carried out with thorough quality control by skilled workers. We produce single-sided boards, multilayer boards, flexible boards, aluminum boards, edge-through-hole boards, thin boards, build-up boards, BGA boards, wire bonding boards, and white LED boards.
With the technology cultivated over many years, we will meet our customers' needs.
Since starting the prototype of single-sided printed circuit boards in 1972, we have been dedicated to manufacturing printed wiring up to the present day. We are also involved in the design of printed wiring patterns and the production of nameplates.
Based on high-speed, high-multilayer substrate manufacturing technology! Capable of meeting various requests.
We would like to introduce our "Custom and Special Purpose Printed Circuit Boards." Based on high-speed, high-multilayer board manufacturing technology, we can meet various demands for rigid boards. We possess high-precision simulation technology, plating technology, lamination and drilling technology, and patterning technology. 【Features】 ■ High Speed ■ High Multilayer ■ High Density *For more details, please refer to the PDF document or feel free to contact us.
4-layer high-density wiring circuit board
Number of layers: Four layers Material: FR-4 Board thickness: 1.57 +/- 0.13 mm Surface treatment: Electroless gold plating Copper foil thickness: H/H~1/1 oz Remark: Impedance control 75 OHM Differential pair: 85/90/100 OHM
